System in Package (SiP) Design Engineer • IoT Group


Vilnius, VL, LT, 08126


We, Teltonika IoT Group, unite and supervise high-tech companies operating under the brand name Teltonika in Lithuania and our representative offices worldwide. We help our companies to grow and create unique IoT devices for the global market by providing all the necessary tools, developing internal systems and administering all the processes. We promote a culture of mutual trust and respect throughout the company group and create the best conditions for all employees to learn and grow.

We cannot imagine our success without a talented and challenge-driven team who always has a wide range of opportunities to adapt their knowledge. Our people are our strength.



We are proud of being a group of companies working on made-in-Lithuania products and are currently looking for a System in Package (SiP) Design Engineer who will be responsible for the design and development of System in package (SiP) chips which combine RF, Analog and Digital ICs, starting with design, simulations and modelling, ending with testing and characterization. You will collaborate with the technology provider in taking over their experience. You will cooperate with other team members within the project in order to ensure the manufacturability and reliability of the designs.




  • The opportunity to contribute to a more convenient and efficient daily life of Teltonika group companies and the creation of the necessary conditions for that
  • Excellent conditions for professional growth and continuous improvement
  • Dynamic, challenging work environment - you will have the opportunity to be at the forefront of changes and contribute to their implementation
  • The opportunity to contribute to the  development of Lithuania‘s semiconductor industry, one of the most ambitious technological projects




  • Design and develop multi-die system in package (SiP) chips which combine RF, Analog and Digital ICs
  • Plan and drive project from concept to production
  • Analyse trends of new generation SiP design technology development
  • Cooperate with the technology provider in taking over the provided information
  • Collaborate with colleagues responsible for product applications and packaging process development in order to implement the project successfully
  • Identifying innovative technologies and driving design strategies for performance and manufacturability of package/SiP design
  • This role may require additional duties and/or tasks, assigned by management




  • Have experience in the design and development of SiP's and/or System on Board from concept to production
  • Have strong experience in Digital, Analog and RF electronics
  • Have expertise in chip packaging design methodologies, package standards, package failure mechanisms and causes
  • Have experience with electrical/electromagnetic/mechanical/thermal simulations, preferably on package/SIP
  • Have strong knowledge of signal integrity and power integrity principles
  • Have knowledge of package/SIP design, SW and HW tools, methodologies and design flows for advanced and mainstream design and manufacturing process technologies would be an advantage
  • Have experience in programming embedded systems would be an advantage
  • Have experience in antenna design would be an advantage
  • Have experience in IC package EMI shielding would be an advantage






We appreciate everyone's efforts and experiences, so we offer an attractive salary that will match your skillset and expertise in the field. The salary for this position ranges from  25,00Eur/h up to 40,00Eur/h (~4170Eur –6670Eur) pre-tax, depending on your experience and expertise. 

*In an employment agreement we specify and define a fixed (tariff) hourly salary rate before taxes. 


Other benefits: 


  • Care about your emotional and physical well-being by offering additional health insurance with included psychologist consultations 
  • Company-paid sports activities (basketball, volleyball, yoga) and other sports events together 
  • Celebration of achievements and fun time together during team-buildings, summer festivals, and other important occasions for us 
  • Opportunity for solid bonuses when participating in the recommendation program
  • Flexible work schedules and hybrid work opportunities
  • Acknowledgements on work anniversaries 
  • We delight with gifts and a day off on your birthday occasion and surprises during various festives 
  • We enjoy snacks together 


If you have questions do not hesitate to contact our recruitment colleague Rūta Virvytytė via tel. +37065567708 or email 


About Teltonika group


Teltonika was established in 1998. Today, the Teltonika company group is one of the world’s leading manufacturers of IoT solutions, with more than 2300 employees. Our company group incorporates Teltonika Telematics (fleet management and mobility solutions, personal and asset trackers), Teltonika Networks (industrial networking equipment), Teltonika Telemedic (telemedicine devices), Teltonika EMS (electronics design and contract manufacturing services), Teltonika Energy (EV charging solutions), and the managing company Teltonika IoT Group. Our public institution Teltonika High-Tech Hill also runs IoT and B2B academies and organises student internships and scholarships.